7201LA30LB8
vs
5962-8986305ZX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
QP SEMICONDUCTOR INC
Part Package Code
LCC
Package Description
LCC-32
QCCN,
Pin Count
32
Manufacturer Package Code
LC32
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1988-01-01
Access Time-Max
30 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
25 MHz
Cycle Time
40 ns
40 ns
JESD-30 Code
R-CQCC-N32
R-XQCC-N32
JESD-609 Code
e0
Length
13.97 mm
13.97 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QCCN
QCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
3.048 mm
3.048 mm
Standby Current-Max
0.0009 A
Supply Current-Max
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
2
1
Compare 7201LA30LB8 with alternatives
Compare 5962-8986305ZX with alternatives