7200L50TPG vs IDT7200L50TD feature comparison

7200L50TPG Integrated Device Technology Inc

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IDT7200L50TD Rochester Electronics LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP28,.3 DIP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT RETRANSMIT
Clock Frequency-Max (fCLK) 15 MHz
Cycle Time 65 ns 65 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e3 e0
Length 34.671 mm 37.1475 mm
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256X9 256X9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.572 mm 5.08 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.08 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1

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