7200L35J8
vs
7200L35SO
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
SOIC
Package Description
PLASTIC, LCC-32
SOIC-28
Pin Count
32
28
Manufacturer Package Code
PL32
PE28
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
35 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
22.2 MHz
22.2 MHz
Cycle Time
45 ns
45 ns
JESD-30 Code
R-PQCC-J32
R-PDSO-G28
JESD-609 Code
e0
e0
Length
13.97 mm
18.3642 mm
Memory Density
2304 bit
2304 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X9
256X9
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
SOP
Package Equivalence Code
LDCC32,.5X.6
SOP28,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
3.048 mm
Standby Current-Max
0.0005 A
0.0005 A
Supply Current-Max
0.125 mA
0.125 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
20
30
Width
11.43 mm
8.763 mm
Base Number Matches
1
1
Compare 7200L35J8 with alternatives
Compare 7200L35SO with alternatives