7200L20TDB
vs
IDT7200L20SOB
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
CDIP
|
SOIC
|
| Package Description |
CERAMIC, DIP-28
|
SOIC-28
|
| Pin Count |
28
|
28
|
| Manufacturer Package Code |
SD28
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Date Of Intro |
1988-01-01
|
|
| Access Time-Max |
20 ns
|
20 ns
|
| Additional Feature |
RETRANSMIT
|
RETRANSMIT
|
| Clock Frequency-Max (fCLK) |
33.3 MHz
|
33.3 MHz
|
| Cycle Time |
30 ns
|
30 ns
|
| JESD-30 Code |
R-GDIP-T28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
37.1475 mm
|
18.3642 mm
|
| Memory Density |
2304 bit
|
2304 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
9
|
9
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
256X9
|
256X9
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP28,.3
|
SOP28,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883 Class B
|
| Seated Height-Max |
5.08 mm
|
3.048 mm
|
| Standby Current-Max |
0.0009 A
|
0.015 A
|
| Supply Current-Max |
0.14 mA
|
0.1 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
8.763 mm
|
| Base Number Matches |
2
|
2
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare 7200L20TDB with alternatives
Compare IDT7200L20SOB with alternatives