71V67703S85BQGI8
vs
71V67703S80BQG8
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
CABGA
|
CABGA
|
Pin Count |
165
|
165
|
Manufacturer Package Code |
BQG165
|
BQG165
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
NLR
|
NLR
|
HTS Code |
8542320041
|
8542320041
|
Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
Access Time-Max |
8.5 ns
|
8 ns
|
Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
87 MHz
|
100 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
15 mm
|
Memory Density |
9437184 bit
|
9437184 bit
|
Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
165
|
165
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
256KX36
|
256KX36
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TBGA
|
TBGA
|
Package Equivalence Code |
BGA165,11X15,40
|
BGA165,11X15,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Standby Current-Max |
0.07 A
|
0.05 A
|
Standby Voltage-Min |
3.14 V
|
3.14 V
|
Supply Current-Max |
0.21 mA
|
0.21 mA
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 71V67703S85BQGI8 with alternatives
Compare 71V67703S80BQG8 with alternatives