71V65803S100BGG
vs
IDT71V65803S100BGG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PBGA
BGA
Package Description
MS-028AA, BGA-119
BGA,
Pin Count
119
119
Manufacturer Package Code
BGG119
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
5 ns
Additional Feature
BURST COUNTER
PIPELINED ARCHITECTURE
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e1
e1
Length
22 mm
22 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX18
512KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.36 mm
2.36 mm
Standby Current-Max
0.04 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.25 mA
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
14 mm
Base Number Matches
2
1
Compare 71V65803S100BGG with alternatives
Compare IDT71V65803S100BGG8 with alternatives