71V65703S85BG
vs
CY7C1355A1-100BGC
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
PBGA
|
BGA
|
Package Description |
14 X 22 MM, PLASTIC, MS-026AA, BGA-119
|
14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
|
Pin Count |
119
|
119
|
Manufacturer Package Code |
BG119
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
8.5 ns
|
8 ns
|
Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
90 MHz
|
100 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
JESD-609 Code |
e0
|
e0
|
Length |
22 mm
|
22 mm
|
Memory Density |
9437184 bit
|
9437184 bit
|
Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
119
|
119
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX36
|
256KX36
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA119,7X17,50
|
BGA119,7X17,50
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.36 mm
|
2.4 mm
|
Standby Current-Max |
0.04 A
|
0.03 A
|
Standby Voltage-Min |
3.14 V
|
3.14 V
|
Supply Current-Max |
0.225 mA
|
0.35 mA
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
NOT SPECIFIED
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 71V65703S85BG with alternatives
Compare CY7C1355A1-100BGC with alternatives