71V546XS133PFI
vs
71V3556S133PFGI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
4.2 ns
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e3
Memory Density
4718592 bit
4718592 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Terminals
100
100
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LQFP
Package Equivalence Code
QFP100,.63X.87
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.045 A
0.045 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.31 mA
0.31 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Base Number Matches
1
2
Pbfree Code
Part Package Code
TQFP
Package Description
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count
100
Manufacturer Package Code
PKG100
Date Of Intro
1998-08-01
Length
20 mm
Number of Functions
1
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Width
14 mm
Compare 71V546XS133PFI with alternatives
Compare 71V3556S133PFGI with alternatives