71V416S10BEG8
vs
IDT71V416S10BEG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
BGA
|
Pin Count |
48
|
48
|
Manufacturer Package Code |
BEG48
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
NLR
|
3A991.B.2.A
|
HTS Code |
8542320041
|
8542.32.00.41
|
Factory Lead Time |
18 Weeks
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Access Time-Max |
10 ns
|
10 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PBGA-B48
|
S-PBGA-B48
|
JESD-609 Code |
e1
|
e1
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
256KX16
|
256KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA48,6X8,30
|
BGA48,6X8,30
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.02 A
|
0.02 A
|
Standby Voltage-Min |
3 V
|
3 V
|
Supply Current-Max |
0.2 mA
|
0.2 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.75 mm
|
0.75 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
2
|
Package Description |
|
BGA, BGA48,6X8,30
|
Length |
|
9 mm
|
Seated Height-Max |
|
1.2 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
9 mm
|
|
|
|
Compare 71V416S10BEG8 with alternatives
Compare IDT71V416S10BEG with alternatives