71V3577S75PFG8 vs 71V3577S75PFGI feature comparison

71V3577S75PFG8 Integrated Device Technology Inc

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71V3577S75PFGI Integrated Device Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP TQFP
Package Description 14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100
Pin Count 100 100
Manufacturer Package Code PKG100 PKG100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1997-09-16 1997-09-16
Access Time-Max 7.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 117 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100
JESD-609 Code e3 e3
Length 20 mm
Memory Density 4718592 bit
Memory IC Type CACHE SRAM
Memory Width 36
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 100
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR
Package Style FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.255 mA
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN TIN
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm
Base Number Matches 2 2

Compare 71V3577S75PFG8 with alternatives

Compare 71V3577S75PFGI with alternatives