71V3576S150BGG8
vs
71V3576S150BGG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.8 ns
3.8 ns
Clock Frequency-Max (fCLK)
150 MHz
150 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e1
e1
Memory Density
4718592 bit
4718592 bit
Memory IC Type
STANDARD SRAM
CACHE SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Terminals
119
119
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.03 A
0.03 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.295 mA
0.295 mA
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
1
Part Package Code
BGA
Package Description
ROHS COMPLIANT, BGA-119
Pin Count
119
Additional Feature
PIPELINED ARCHITECTURE
Length
22 mm
Number of Functions
1
Seated Height-Max
2.36 mm
Width
14 mm
Compare 71V3576S150BGG8 with alternatives
Compare 71V3576S150BGG with alternatives