71V3559S85BGGI
vs
71V3559S85BGI8
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
PBGA
|
Package Description |
BGA, BGA119,7X17,50
|
|
Pin Count |
119
|
119
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
8.5 ns
|
8.5 ns
|
Additional Feature |
FLOW-THROUGH ARCHITECHTURE
|
|
Alternate Memory Width |
18
|
|
Clock Frequency-Max (fCLK) |
90 MHz
|
90 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
JESD-609 Code |
e1
|
e0
|
Length |
22 mm
|
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
CACHE SRAM
|
ZBT SRAM
|
Memory Width |
18
|
18
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
|
Number of Terminals |
119
|
119
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
256KX18
|
256KX18
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA119,7X17,50
|
BGA119,7X17,50
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.36 mm
|
|
Standby Current-Max |
0.045 A
|
0.045 A
|
Standby Voltage-Min |
3.14 V
|
3.14 V
|
Supply Current-Max |
0.235 mA
|
0.235 mA
|
Supply Voltage-Max (Vsup) |
3.465 V
|
|
Supply Voltage-Min (Vsup) |
3.135 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
14 mm
|
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
BG119
|
|
|
|
Compare 71V3559S85BGGI with alternatives
Compare 71V3559S85BGI8 with alternatives