71V3558SA133BQGI
vs
IDT71V3558XSA133BQI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
Pin Count
165
Manufacturer Package Code
BQG165
Reach Compliance Code
compliant
not_compliant
ECCN Code
NLR
3A991.B.2.A
HTS Code
8542320041
8542.32.00.41
Samacsys Manufacturer
Renesas Electronics
Access Time-Max
4.2 ns
4.2 ns
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e0
Length
15 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Terminals
165
165
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX18
256KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Equivalence Code
BGA165,11X15,40
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Standby Current-Max
0.045 A
0.045 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.31 mA
0.31 mA
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
Base Number Matches
2
2
Package Description
BGA, BGA165,11X15,40
Compare 71V3558SA133BQGI with alternatives
Compare IDT71V3558XSA133BQI with alternatives