71V3556SA133BGI vs IDT71V3556XSA133BGGI feature comparison

71V3556SA133BGI Rochester Electronics LLC

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IDT71V3556XSA133BGGI Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA, BGA119,7X17,50
Pin Count 119 119
Reach Compliance Code unknown compliant
Access Time-Max 4.2 ns 4.2 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.36 mm 2.36 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 14 mm 14 mm
Base Number Matches 3 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.045 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.31 mA

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