71V30S35TF vs 71V30L35TFG8 feature comparison

71V30S35TF Integrated Device Technology Inc

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71V30L35TFG8 Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP
Pin Count 64
Manufacturer Package Code PP64
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-G64 S-PQFP-F64
JESD-609 Code e0 e3
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Ports 2 2
Number of Terminals 64 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX8 1KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFF
Package Equivalence Code QFP64,.47SQ,20 QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.003 A
Standby Voltage-Min 3 V 3 V
Supply Current-Max 0.145 mA 0.115 mA
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn) - annealed
Terminal Form GULL WING FLAT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 1
Package Description QFF, QFP64,.47SQ,20
Length 10 mm
Number of Functions 1
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Width 10 mm

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Compare 71V30L35TFG8 with alternatives