71V2558XS200BQ vs IS61LPS25618A-200B3 feature comparison

71V2558XS200BQ Integrated Device Technology Inc

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IS61LPS25618A-200B3 ABLIC Inc.

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC SEIKO INSTRUMENTS USA INC
Part Package Code BGA BGA
Package Description 13 X 15 MM, FPBGA-165 TBGA,
Pin Count 165 165
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.2 ns 3.1 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0
Length 15 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.04 A
Standby Voltage-Min 1.8 V
Supply Current-Max 0.4 mA
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 4 2

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Compare IS61LPS25618A-200B3 with alternatives