71T75902S85BG8
vs
IDT71T75902S85BGG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PBGA
BGA
Pin Count
119
119
Manufacturer Package Code
BG119
Reach Compliance Code
not_compliant
compliant
ECCN Code
NLR
3A991.B.2.A
HTS Code
8542320041
8542.32.00.41
Samacsys Manufacturer
Renesas Electronics
Access Time-Max
85 ns
8.5 ns
Clock Frequency-Max (fCLK)
90.9 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e1
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
1
Number of Terminals
119
119
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX18
1MX18
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.36 mm
2.36 mm
Standby Current-Max
0.04 A
Standby Voltage-Min
2.375 V
Supply Current-Max
0.225 mA
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
14 mm
Base Number Matches
1
3
Package Description
BGA,
Additional Feature
FLOW-THROUGH ARCHITECTURE
Compare 71T75902S85BG8 with alternatives
Compare IDT71T75902S85BGG with alternatives