71T75902S85BG vs IDT71T75902S85BGG feature comparison

71T75902S85BG Renesas Electronics Corporation

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IDT71T75902S85BGG Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PBGA BGA
Pin Count 119 119
Manufacturer Package Code BG119
Reach Compliance Code not_compliant compliant
ECCN Code NLR 3A991.B.2.A
HTS Code 8542320041 8542.32.00.41
Factory Lead Time 4 Weeks
Samacsys Manufacturer Renesas Electronics
Access Time-Max 85 ns 8.5 ns
Clock Frequency-Max (fCLK) 90.9 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 1
Number of Terminals 119 119
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 1MX18
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 2.36 mm
Standby Current-Max 0.04 A
Standby Voltage-Min 2.375 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 14 mm
Base Number Matches 2 1
Package Description BGA,
Additional Feature FLOW-THROUGH ARCHITECTURE

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