71T75702S85BGI
vs
IDT71T75702S85BGI8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, PLASTIC, MS-028AA, BGA-119
14 X 22 MM, PLASTIC, BGA-119
Pin Count
119
119
Reach Compliance Code
unknown
not_compliant
Access Time-Max
8.5 ns
8.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.36 mm
2.36 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
2
1
Rohs Code
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Clock Frequency-Max (fCLK)
90 MHz
I/O Type
COMMON
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.06 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.245 mA
Time@Peak Reflow Temperature-Max (s)
20
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