71T75602S166BGGI8
vs
71T75602S150PF
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PBGA
|
QFP
|
| Pin Count |
119
|
100
|
| Manufacturer Package Code |
BGG119
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
NLR
|
3A991.B.2.A
|
| HTS Code |
8542320041
|
8542.32.00.41
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
3.5 ns
|
3.8 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
166 MHz
|
150 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B119
|
R-PQFP-G100
|
| JESD-609 Code |
e1
|
e0
|
| Length |
22 mm
|
20 mm
|
| Memory Density |
18874368 bit
|
18874368 bit
|
| Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
119
|
100
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX36
|
512KX36
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LQFP
|
| Package Equivalence Code |
BGA119,7X17,50
|
QFP100,.63X.87
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.36 mm
|
1.6 mm
|
| Standby Current-Max |
0.06 A
|
0.04 A
|
| Standby Voltage-Min |
2.38 V
|
2.38 V
|
| Supply Current-Max |
0.265 mA
|
0.215 mA
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
15
|
| Package Description |
|
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100
|
|
|
|
Compare 71T75602S166BGGI8 with alternatives
Compare 71T75602S150PF with alternatives