7143SA35PFG8 vs 7143SA35PN feature comparison

7143SA35PFG8 Integrated Device Technology Inc

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7143SA35PN Integrated Device Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QFP, QFP, QFP100,.63SQ,20
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Memory Density 32768 bit 32768 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Number of Functions 1
Number of Terminals 100 100
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX16 2KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63SQ,20
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Standby Current-Max 0.015 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.295 mA
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) 20

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