7143LA20PF8
vs
7143LA20J8
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
PLCC
Package Description
TQFP-100
PLASTIC, LCC-68
Pin Count
100
68
Manufacturer Package Code
PN100
PL68
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQFP-G100
S-PQCC-J68
JESD-609 Code
e0
e0
Length
14 mm
24.2062 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
100
68
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX16
2KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QCCJ
Package Equivalence Code
QFP100,.63SQ,20
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.57 mm
Standby Current-Max
0.0015 A
0.0015 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.28 mA
0.28 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
20
Width
14 mm
24.2062 mm
Base Number Matches
2
2
Additional Feature
AUTOMATIC POWER-DOWN
Compare 7143LA20PF8 with alternatives
Compare 7143LA20J8 with alternatives