7140SA25JGI
vs
IDT7140SA25FGB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
QFP
Package Description
QCCJ, LDCC52,.8SQ
QFF, QFL48,.75SQ
Pin Count
52
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J52
S-CQFP-F48
JESD-609 Code
e3
e3
Length
19.1262 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
52
48
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
QFF
Package Equivalence Code
LDCC52,.8SQ
QFL48,.75SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
2.7432 mm
Standby Current-Max
0.03 A
0.03 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.28 mA
0.28 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
J BEND
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
19.1262 mm
Base Number Matches
4
2
Screening Level
MIL-PRF-38535 Class Q
Compare 7140SA25JGI with alternatives
Compare IDT7140SA25FGB with alternatives