7140LA25JGI8
vs
IDT7140SA25JB8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52
Reach Compliance Code
compliant
not_compliant
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J52
S-PQCC-J52
JESD-609 Code
e3
e0
Length
19.1262 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
Number of Ports
2
2
Number of Terminals
52
52
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC52,.8SQ
LDCC52,.8SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Standby Current-Max
0.004 A
0.03 A
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.22 mA
0.28 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Width
19.1262 mm
Base Number Matches
1
1
Pbfree Code
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Screening Level
38535Q/M;38534H;883B
Compare 7140LA25JGI8 with alternatives
Compare IDT7140SA25JB8 with alternatives