7133SA25PN vs 7133LA25FGI8 feature comparison

7133SA25PN Integrated Device Technology Inc

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7133LA25FGI8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QFP, QFP100,.63SQ,20 QFF,
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code S-PQFP-G100 S-PQFP-F68
JESD-609 Code e0
Memory Density 32768 bit 32768 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Ports 2
Number of Terminals 100 68
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2KX16 2KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFF
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Standby Current-Max 0.015 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING FLAT
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Base Number Matches 1 1
Number of Functions 1

Compare 7133SA25PN with alternatives

Compare 7133LA25FGI8 with alternatives