7133SA25PFG
vs
IDT7133SA25JG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP,
0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
S-PQFP-G100
S-PQCC-J68
Memory Density
32768 bit
32768 bit
Memory IC Type
DUAL-PORT SRAM
DUAL-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
100
68
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX16
2KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
J BEND
Terminal Position
QUAD
QUAD
Base Number Matches
7
4
Pbfree Code
Rohs Code
Part Package Code
LCC
Pin Count
68
JESD-609 Code
e3
Length
24.2062 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
4.572 mm
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
24.2062 mm
Compare 7133SA25PFG with alternatives
Compare IDT7133SA25JG with alternatives