7133SA25JI vs 7133LA25FG feature comparison

7133SA25JI Integrated Device Technology Inc

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7133LA25FG Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC
Package Description 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 QFF,
Pin Count 68
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code S-PQCC-J68 S-PQFP-F68
JESD-609 Code e0
Length 24.2062 mm
Memory Density 32768 bit 32768 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 68 68
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2KX16 2KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QFF
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Standby Current-Max 0.004 A
Standby Voltage-Min 2 V
Supply Current-Max 0.33 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND FLAT
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm
Base Number Matches 2 7

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