7133LA55JB
vs
7133LA55JGB8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
Package Description
QCCJ, LDCC68,1.0SQ
QCCN,
Pin Count
68
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
S-PQCC-N68
JESD-609 Code
e0
Length
24.2062 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
2
Number of Terminals
68
68
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX16
2KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCN
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535
MIL-PRF-38535
Seated Height-Max
4.572 mm
Standby Current-Max
0.004 A
Standby Voltage-Min
2 V
Supply Current-Max
0.285 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
J BEND
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
24.2062 mm
Base Number Matches
1
1
Compare 7133LA55JB with alternatives
Compare 7133LA55JGB8 with alternatives