71321LA25TF9 vs 71V321L25TFG feature comparison

71321LA25TF9 Integrated Device Technology Inc

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71V321L25TFG Renesas Electronics Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code QFP TQFP
Package Description 10 X 10 MM, 1.40 MM HEIGHT, STQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 NLR
HTS Code 8542.32.00.41 8542320041
Access Time-Max 25 ns 25 ns
Additional Feature INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e0 e3
Length 10 mm
Memory Density 16384 bit 16384 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Width 10 mm
Base Number Matches 1 2
Manufacturer Package Code PPG64
Factory Lead Time 26 Weeks, 1 Day
Samacsys Manufacturer Renesas Electronics
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare 71321LA25TF9 with alternatives

Compare 71V321L25TFG with alternatives