7130SA55JGB
vs
IDT7130SA55JG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
Package Description
QCCJ, LDCC52,.8SQ
Pin Count
52
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J52
S-PQCC-J52
JESD-609 Code
e3
e3
Length
19.1262 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
Number of Ports
2
2
Number of Terminals
52
52
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1KX8
1KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC52,.8SQ
LDCC52,.8SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
4.572 mm
Standby Current-Max
0.03 A
0.015 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.19 mA
0.155 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
Matte Tin (Sn) - annealed
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19.1262 mm
Base Number Matches
1
1
Compare 7130SA55JGB with alternatives
Compare IDT7130SA55JG8 with alternatives