7130SA25CGI8 vs 7130SA25TFG feature comparison

7130SA25CGI8 Integrated Device Technology Inc

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7130SA25TFG Integrated Device Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, DIP48,.6 LFQFP, QFP64,.47SQ,20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T48 S-PQFP-G64
JESD-609 Code e3 e3
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Ports 2 2
Number of Terminals 48 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1KX8 1KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP LFQFP
Package Equivalence Code DIP48,.6 QFP64,.47SQ,20
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.03 A 0.015 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.22 mA 0.22 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN Matte Tin (Sn) - annealed
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL QUAD
Base Number Matches 2 12
Part Package Code QFP
Pin Count 64
Length 10 mm
Moisture Sensitivity Level 3
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm

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