7130LA35PFB8 vs IDT7130LA35J feature comparison

7130LA35PFB8 Integrated Device Technology Inc

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IDT7130LA35J Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-G64 S-PQCC-J52
JESD-609 Code e0 e0
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Ports 2 2
Number of Terminals 64 52
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1KX8 1KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP64,.66SQ,32 LDCC52,.8SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 225
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.004 A 0.004 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.17 mA 0.12 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Base Number Matches 2 8
Part Package Code LCC
Package Description PLASTIC, LCC-52
Pin Count 52
Length 19.1262 mm
Number of Functions 1
Seated Height-Max 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 19.1262 mm

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