71256SA12TPG vs W24L257ACK-12 feature comparison

71256SA12TPG Integrated Device Technology Inc

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W24L257ACK-12 Winbond Electronics Corp

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC WINBOND ELECTRONICS CORP
Part Package Code PDIP DIP
Package Description 0.300 INCH, GREEN, PLASTIC, DIP-28 DIP,
Pin Count 28 28
Manufacturer Package Code PTG28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1988-01-01
Access Time-Max 12 ns 12 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e3 e3
Length 34.671 mm 35.26 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.45 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.16 mA
Supply Voltage-Max (Vsup) 5.5 V 3.465 V
Supply Voltage-Min (Vsup) 4.5 V 3.135 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1

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