70V9269L12PRF
vs
70V9269L12PRFGI8
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
TQFP
|
| Pin Count |
128
|
128
|
| Manufacturer Package Code |
PK128
|
PKG128
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
12 ns
|
|
| Clock Frequency-Max (fCLK) |
50 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PQFP-G128
|
|
| JESD-609 Code |
e0
|
e3
|
| Memory Density |
262144 bit
|
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
16
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Ports |
2
|
|
| Number of Terminals |
128
|
|
| Number of Words |
16384 words
|
|
| Number of Words Code |
16000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
16KX16
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP128,.63X.87,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Qualification Status |
Not Qualified
|
|
| Standby Current-Max |
0.003 A
|
|
| Standby Voltage-Min |
3 V
|
|
| Supply Current-Max |
0.205 mA
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare 70V9269L12PRF with alternatives
Compare 70V9269L12PRFGI8 with alternatives