70V7339S133BF vs 70T3519S133DR feature comparison

70V7339S133BF Integrated Device Technology Inc

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70T3519S133DR Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA PQFP
Package Description 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 28 X 28 MM, 3.50 MM HEIGHT, PLASTIC, QFP-208
Pin Count 208 208
Manufacturer Package Code BF208 DR208
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PQFP-G208
JESD-609 Code e0 e0
Length 15 mm 28 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX18 256KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FQFP
Package Equivalence Code BGA208,17X17,32 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 4.1 mm
Standby Current-Max 0.03 A 0.015 A
Standby Voltage-Min 3.15 V 2.4 V
Supply Current-Max 0.645 mA 0.37 mA
Supply Voltage-Max (Vsup) 3.45 V 2.6 V
Supply Voltage-Min (Vsup) 3.15 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm 28 mm
Base Number Matches 2 1

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