70V658S15BC8
vs
70V658S15BFI
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
BGA
|
Pin Count |
256
|
208
|
Manufacturer Package Code |
BC256
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
NLR
|
3A991.B.2.A
|
HTS Code |
8542320041
|
8542.32.00.41
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Access Time-Max |
15 ns
|
15 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B208
|
JESD-609 Code |
e0
|
e0
|
Length |
17 mm
|
15 mm
|
Memory Density |
2359296 bit
|
2359296 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
256
|
208
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
64KX36
|
64KX36
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
TFBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA208,17X17,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.2 mm
|
Standby Current-Max |
0.015 A
|
0.015 A
|
Standby Voltage-Min |
3.15 V
|
3.15 V
|
Supply Current-Max |
0.44 mA
|
0.49 mA
|
Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
Width |
17 mm
|
15 mm
|
Base Number Matches |
1
|
3
|
Package Description |
|
TFBGA, BGA208,17X17,32
|
|
|
|
Compare 70V658S15BC8 with alternatives
Compare 70V658S15BFI with alternatives