70V657S10DR8
vs
70V657S10BC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
RENESAS ELECTRONICS CORP
Part Package Code
QFP
CABGA
Package Description
FQFP,
Pin Count
208
256
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
NLR
HTS Code
8542.32.00.41
8542320041
Access Time-Max
10 ns
10 ns
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e0
e0
Length
28 mm
17 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
208
256
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX36
32KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
1.5 mm
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
28 mm
17 mm
Base Number Matches
2
3
Manufacturer Package Code
BC256
Samacsys Manufacturer
Renesas Electronics
I/O Type
COMMON
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA256,16X16,40
Standby Current-Max
0.015 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.5 mA
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