70V639S15BCGI8
vs
IDT70V639S15BC8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LBGA,
LBGA, BGA256,16X16,40
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Memory Density
2359296 bit
2359296 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
256
256
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX18
128KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.7 mm
1.5 mm
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
256
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA256,16X16,40
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Standby Current-Max
0.015 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.44 mA
Terminal Finish
Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s)
20
Compare 70V639S15BCGI8 with alternatives
Compare IDT70V639S15BC8 with alternatives