70V639S10BCG8 vs 70V639S10PRFGI feature comparison

70V639S10BCG8 Integrated Device Technology Inc

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70V639S10PRFGI Integrated Device Technology Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description LBGA, LFQFP,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 10 ns
JESD-30 Code S-PBGA-B256 R-PQFP-G128
Length 17 mm 20 mm
Memory Density 2359296 bit 2359296 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 256 128
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX18 128KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LFQFP
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.7 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 17 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code QFP
Pin Count 128
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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