70V631S12BFG vs 70T631S12BCI8 feature comparison

70V631S12BFG Integrated Device Technology Inc

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70T631S12BCI8 Renesas Electronics Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Package Description BGA,
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A NLR
HTS Code 8542.32.00.41 8542320041
Access Time-Max 12 ns 12 ns
JESD-30 Code S-PBGA-B208 S-PBGA-B256
Memory Density 4718592 bit 4718592 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 208 256
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Supply Voltage-Max (Vsup) 3.45 V 2.6 V
Supply Voltage-Min (Vsup) 3.15 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Base Number Matches 8 1
Pbfree Code No
Part Package Code CABGA
Pin Count 256
Manufacturer Package Code BC256
Samacsys Manufacturer Renesas Electronics
I/O Type COMMON
JESD-609 Code e0
Length 17 mm
Moisture Sensitivity Level 3
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code BGA256,16X16,40
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.395 mA
Terminal Finish TIN LEAD
Terminal Pitch 1 mm
Width 17 mm

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