70V3599S166DR
vs
IDT70P3599S166DR8
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PQFP
|
|
Package Description |
28 X 28 MM, 3.50 MM HEIGHT, PLASTIC, QFP-208
|
,
|
Pin Count |
208
|
|
Manufacturer Package Code |
DR208
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
4 ns
|
|
Clock Frequency-Max (fCLK) |
166 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
S-PQFP-G208
|
|
JESD-609 Code |
e0
|
|
Memory Density |
4718592 bit
|
|
Memory IC Type |
MULTI-PORT SRAM
|
|
Memory Width |
36
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Ports |
2
|
|
Number of Terminals |
208
|
|
Number of Words |
131072 words
|
|
Number of Words Code |
128000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
128KX36
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
QFP
|
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK
|
|
Parallel/Serial |
PARALLEL
|
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
|
Standby Current-Max |
0.03 A
|
|
Standby Voltage-Min |
3.15 V
|
|
Supply Current-Max |
0.5 mA
|
|
Supply Voltage-Max (Vsup) |
3.45 V
|
|
Supply Voltage-Min (Vsup) |
3.15 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 70V3599S166DR with alternatives
Compare IDT70P3599S166DR8 with alternatives