70V3599S133DRGI8
vs
IDT70V3599S133DRG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP, QFP208,1.2SQ,20
QFP, QFP208,1.2SQ,20
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
4.2 ns
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
JESD-609 Code
e3
e3
Memory Density
4718592 bit
4718592 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
APPLICATION SPECIFIC SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP208,1.2SQ,20
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.04 A
0.03 A
Standby Voltage-Min
3.15 V
3.15 V
Supply Current-Max
0.48 mA
0.4 mA
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Base Number Matches
2
1
Compare 70V3599S133DRGI8 with alternatives
Compare IDT70V3599S133DRG8 with alternatives