70V3599S133BC
vs
IDT70T3599S133BCG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
Package Description
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
BGA, BGA256,16X16,40
Pin Count
256
Manufacturer Package Code
BC256
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
15 ns
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Memory Density
4718592 bit
4718592 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Ports
2
2
Number of Terminals
256
256
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.03 A
0.015 A
Standby Voltage-Min
3.15 V
2.4 V
Supply Current-Max
0.4 mA
0.37 mA
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Base Number Matches
2
1
Compare 70V3599S133BC with alternatives
Compare IDT70T3599S133BCG8 with alternatives