70V3579S4DRG8
vs
70V3579S5DRGI8
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PQFP
|
|
Package Description |
28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, MO-143FA-1, QFP-208
|
FQFP,
|
Pin Count |
208
|
|
Manufacturer Package Code |
DRG208
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
4.2 ns
|
5 ns
|
Additional Feature |
PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE
|
PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE
|
JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
Length |
28 mm
|
28 mm
|
Memory Density |
1179648 bit
|
1179648 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
DUAL-PORT SRAM
|
Memory Width |
36
|
36
|
Number of Functions |
1
|
1
|
Number of Terminals |
208
|
208
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
32KX36
|
32KX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Seated Height-Max |
4.1 mm
|
4.1 mm
|
Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28 mm
|
28 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 70V3579S4DRG8 with alternatives
Compare 70V3579S5DRGI8 with alternatives