70V3379S5BF8 vs IDT70V3379S5BFG feature comparison

70V3379S5BF8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70V3379S5BFG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description FINE PITCH, BGA-208 LFBGA, BGA208,17X17,32
Pin Count 208 208
Manufacturer Package Code BF208
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1999-01-01
Access Time-Max 5 ns 5 ns
Additional Feature PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-CBGA-B208
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 589824 bit 589824 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX18 32KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TFBGA LFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.7 mm
Standby Current-Max 0.015 A 0.015 A
Standby Voltage-Min 3.15 V 3.15 V
Supply Current-Max 0.36 mA 0.36 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 15 mm 15 mm
Base Number Matches 2 1

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Compare IDT70V3379S5BFG with alternatives