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70V3319S133BF vs IDT70T3319S133BF feature comparison

70V3319S133BF Integrated Device Technology Inc

Buy Now Datasheet

IDT70T3319S133BF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 TFBGA, BGA208,17X17,32
Pin Count 208 208
Manufacturer Package Code BF208
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.2 mm
Standby Current-Max 0.03 A 0.015 A
Standby Voltage-Min 3.15 V 2.4 V
Supply Current-Max 0.4 mA 0.37 mA
Supply Voltage-Max (Vsup) 3.45 V 2.6 V
Supply Voltage-Min (Vsup) 3.15 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 15 mm 15 mm
Base Number Matches 2 1
Memory » SRAMs
Memory » SRAMs

Compare 70V3319S133BF with alternatives

Compare IDT70T3319S133BF with alternatives