70V27L35PF vs 7027S35PFG feature comparison

70V27L35PF Integrated Device Technology Inc

Buy Now Datasheet

7027S35PFG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 QFP,
Pin Count 100
Manufacturer Package Code PN100
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature INTERRUPT FLAGS
I/O Type COMMON
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e0
Length 14 mm
Memory Density 524288 bit 524288 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 100 100
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX16 32KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Standby Current-Max 0.003 A
Standby Voltage-Min 3 V
Supply Current-Max 0.19 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm
Base Number Matches 17 3

Compare 70V27L35PF with alternatives

Compare 7027S35PFG with alternatives