70V27L20PFG8
vs
70V27S20BFG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
Access Time-Max
20 ns
20 ns
JESD-30 Code
S-PQFP-G100
S-PBGA-B144
Memory Density
524288 bit
524288 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
100
144
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX16
32KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
BGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Position
QUAD
BOTTOM
Base Number Matches
1
6
Pbfree Code
Part Package Code
BGA
Package Description
BGA, BGA144,13X13,32
Pin Count
144
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-609 Code
e3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA144,13X13,32
Qualification Status
Not Qualified
Standby Current-Max
0.006 A
Standby Voltage-Min
3 V
Supply Current-Max
0.255 mA
Terminal Finish
MATTE TIN
Terminal Pitch
0.8 mm
Compare 70V27L20PFG8 with alternatives
Compare 70V27S20BFG with alternatives