70V261L55PFG8
vs
70261L55PFG8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LFQFP,
QFP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e3
Length
14 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
DUAL-PORT SRAM
DUAL-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX16
16KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
Base Number Matches
1
1
Compare 70V261L55PFG8 with alternatives
Compare 70261L55PFG8 with alternatives