70V25TL55PF
vs
70V25S55PFGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
e3
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Ports
2
Number of Terminals
100
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX16
8KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Equivalence Code
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0025 A
Standby Voltage-Min
3 V
Supply Current-Max
0.155 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Base Number Matches
1
1
Part Package Code
QFP
Package Description
LFQFP,
Pin Count
100
Length
14 mm
Number of Functions
1
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Width
14 mm
Compare 70V25TL55PF with alternatives
Compare 70V25S55PFGI with alternatives